SMT – Layout

Our SMT lines use nitrogen reflow all the times and are equipped with Auto Solder Printer, SPI, Component Verify System and 100% AOI to ensure soldering quality and stability.

SMT Line A

SMT Line B

SMT Line C

The facility is currently under construction and is expected to begin production in September 2025.

SMT – Capability

We have expertise in BGA inspection, reballing, and rework, with proven experience handling BGA packages exceeding 1,000 balls. Our SMT capabilities also support placement of components with over 1,500 chips.

ITEM	JSE CAPABILITY
SMT (Pick & Place)	Mounting Accuracy : +/-0.05mm
Chip Component	Min : 0201, >1500 chips
IC (BGA/QFN)	Min : Pitch 0.30mm, ɸ0.20mm, >1000 balls
PCB	Max length : 510mm, Max width : 460mm, experience : 8L / T=3.0mm / FPC / R-FPCB

DIP – Layout

We have two DIP lines with flexible manpower to meet different process needs. Testing and assembly are arranged based on requirements.

ESD Protect

Each department sets up test points and conducts regular impedance measurements. Ground-fault alarm systems are also installed to ensure grounding effectiveness and prevent ESD damage.

Other Equipment